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πŸ“™ Silicon Photonics: Fundamentals and Devices by M. Jamal Deen, P. K. Basu(auth.), Arthur Willoughby, Peter Capper, Safa Kasap(eds.) β€” free pdf


The creation of affordable high speed optical communications using standard semiconductor manufacturing technology is a principal aim of silicon photonics research. This would involve replacing copper connections with optical fibres or waveguides, and electrons with photons. With applications such as telecommunications and information processing, light detection, spectroscopy, holography and robotics, silicon photonics has the potential to revolutionise electronic-only systems.Β Β  Providing an overview of the physics, technology and device operation of photonic devices using exclusively silicon and related alloys, the book includes:
  • Basic Properties of Silicon
  • Quantum Wells, Wires, Dots and Superlattices
  • Absorption Processes in Semiconductors
  • Light Emitters in Silicon
  • Photodetectors , Photodiodes and Phototransistors
  • Raman Lasers including Raman Scattering
  • Guided Lightwaves
  • Planar Waveguide Devices
  • Fabrication Techniques and Material Systems

Silicon Photonics: Fundamentals and Devices outlines the basic principles of operation of devices, the structures of the devices, and offers an insight into state-of-the-art and future developments.

Content:
Chapter 1 Introduction to Silicon Photonics (pages 1–12):
Chapter 2 Basic Properties of Silicon (pages 13–45):
Chapter 3 Quantum Structures (pages 47–67):
Chapter 4 Optical Processes (pages 69–108):
Chapter 5 Optical Processes in Quantum Structures (pages 109–137):
Chapter 6 Light Emitters in Si (pages 139–170):
Chapter 7 Si Light Modulators (pages 171–196):
Chapter 8 Silicon Photodetectors (pages 197–247):
Chapter 9 Raman Lasers (pages 249–263):
Chapter 10 Guided Lightwaves: Introduction (pages 265–302):
Chapter 11 Principle of Planar Waveguide Devices (pages 303–331):
Chapter 12 Waveguides for Dense Wavelength?Division Multiplexing (DWDM) Systems (pages 333–352):
Chapter 13 Fabrication Techniques and Materials Systems (pages 353–401):

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